Wetting dynamics study of Sn-Ag solder during reflow

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Li, Song ^a   An, Bing ^a   Zhang, Tong Jun ^a   Wu, Yi Ping ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; SOLDERED JOINTS; TIN COMPOUNDS; WETTING;

ELECTRONIC CONNECTION; ELECTRONIC INTERCONNECTS; TIME-DEPENDENT CONTACT ANGLE VARIATION;

SOLDERING ALLOYS;

EID: 42749098774     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251398     Document Type: Conference Paper

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