Influence of materials data on the performance modelling in the design of MEMS packages

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 57-62

  Fischer, Sebastian ^a   Wilde, Jürgen ^a   Deier, Erik ^a   Zukowski, Elena ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; CONDUCTIVE MATERIALS; CONTROL NONLINEARITIES; DATA ACQUISITION; FINITE ELEMENT METHOD; TEMPERATURE CONTROL; VISCOELASTICITY; VISCOPLASTICITY;

BONDING WIRES; CONDUCTIVE ADHESIVES; MATERIALS DATA; MEMS PACKAGES;

MATERIALS;

EID: 2442547579     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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8. K. Krupka, "Piezoresistiver Silizium Stress-Mikrosensor zur Spannungsanalyse." Phd Thesis, TU Berlin, FB Elektrotechnik 1999
9. th GMM-Workshop. 31.03/01.04 2003, Bielefeld
10. rd. International Micro Materials 17-19 April 2000 Berlin, Hrgs. B.Michel et al, p. 206-208