A specialist manufacturer's outlook on the future of ceramics and ceramic microsystems

IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Volumn , Issue , 2006, Pages 16-30

  Bechtold, Franz ^a  

^a VIA Electronic GmbH ^*  (Germany)

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EID: 84878238873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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