An enlarged process window for hot embossing

Journal of Micromechanics and Microengineering

Volumn 18, Issue 4, 2008, Pages

  Yao, Donggang ^a   Kuduva Raman Thanumoorthy, Ramasubramani ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIES; MICROSTRUCTURE; PRESSURE EFFECTS;

EMBOSSING THICKNESS; HOT EMBOSSING; PROCESS WINDOW;

THICK FILMS;

EID: 42549083303     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/4/045023     Document Type: Article

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