Buried Ni/Cu(001) interface at the atomic scale

Physical Review Letters

Volumn 100, Issue 14, 2008, Pages

  Meyerheim, H L ^a   Sander, D ^a   Negulyaev, N N ^b   Stepanyuk, V S ^a   Popescu, R ^a,d   Popa, I ^c   Kirschner, J ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b MARTIN LUTHER UNIVERSITY HALLE WITTENBERG   (Germany)

^c EUROPEAN SYNCHROTRON RADIATION FACILITY   (France)

^d UNIVERSITY OF KARLSRUHE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC SCALE SIMULATIONS; INTERFACE STRUCTURE;

COMPUTER SIMULATION; COPPER; INTERFACES (MATERIALS); MONOLAYERS; THERMAL EFFECTS; X RAY ANALYSIS;

NICKEL;

EID: 42149092517     PISSN: 00319007     EISSN: 10797114     Source Type: Journal    
DOI: 10.1103/PhysRevLett.100.146101     Document Type: Article

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