Hot embossing/bonding of a poly(ethylene terephthalate) (PET) microfluidic chip

Journal of Micromechanics and Microengineering

Volumn 18, Issue 1, 2008, Pages

  Li, J M ^a   Liu, C ^a   Qiao, H C ^a   Zhu, L Y ^a   Chen, G ^a   Dai, X D ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPHORESIS; INTERFACIAL ENERGY; LOW TEMPERATURE EFFECTS; MICROFABRICATION; MICROFLUIDICS; POLYETHYLENE TEREPHTHALATES; PRESSURE EFFECTS;

HOT EMBOSSING; LOW BONDING TEMPERATURE; MICROFLUIDIC CHIP PRODUCTION;

MICROPROCESSOR CHIPS;

EID: 41849098862     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/1/015008     Document Type: Article

References (12)

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