Effects of contact-stress on hot-embossed PMMA microchannel wall profile

Microsystem Technologies

Volumn 11, Issue 4-5, 2005, Pages 353-357

  Lei, K F ^a   Li, W J ^a   Yam, Y ^a  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Micro hot embossing; Microchannel; Microfluidics

Indexed keywords

COMPRESSION TESTING; COSTS; FLUIDICS; STRESSES; SUBSTRATES; WALL FLOW;

MICRO HOT EMBOSSING; MICROCHANNEL; MICROFLUIDICS; THERMAL COMPRESSION;

POLYMETHYL METHACRYLATES;

EID: 21044438165     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0454-8     Document Type: Conference Paper

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