PCS power amplifier module package using selectively anodized aluminum substrate

Proceedings of the 36th European Microwave Conference, EuMC 2006

Volumn , Issue , 2006, Pages 1767-1770

  Shin, Seong Ho ^a   Lee, Ju Hyang ^b   Sohn, Bo In ^a   Ryu, Seung Han ^a   Kwon, Young Se ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; HEAT LOSSES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; VOLTAGE CONTROL;

ADJACENT CHANNEL POWER RATIO (ACPR); SUPPLY VOLTAGE;

POWER AMPLIFIERS;

EID: 41649120826     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2006.281485     Document Type: Conference Paper

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