Selectively anodized aluminum substrates for microwave power module package

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1904-1908

  Shin, Seong Ho ^a   Kwon, Young Se ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; ANODIC OXIDATION; ELECTROPLATING; HEAT SINKS; MICROWAVES; Q FACTOR MEASUREMENT; SUBSTRATES; WAVEGUIDES;

HIGH-Q INDUCTORS; MICROWAVE POWER MODULE PACKAGE; PLANAR SPIRAL INDUCTORS; POWER CHIPS;

ELECTRONICS PACKAGING;

EID: 24644480273     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. P. Garrou, "Wafer level chip scale packaging: an overview," IEEE Tran. Adv. Packag., 23, pp. 198-205, 2000.
2. S. M. Vaezi-Nejad, "Primary investigation of anodized aluminium as a substrate for hybrid microelectronics," Int. J. Electronics, vol. 68, No. 1, pp. 59-68, 1990.
3. th GAAS Sym. pp. 587-590, 2004
4. th GAAS Sym. pp. 595-598, 2004
5. S. Mehmet, et al., " A 2.4 GHz bipolar oscillator with integrated resonator," IEEE J. Solid-State Circuits, pp. 268-270, Feb. 1996.
6. H. Okabe, et al., "Characterization of spiral inductor on a composite-resin low-impedance substrate nd its application to microwave circuits," IEEE Trans Comp., Packag., Manufact. Technol. B, vol. 21, pp. 269-273, Aug. 1998.
7. In-Ho Jeong, et al., "High quality RF passive integration using 35 μm thick oxide manufacturing technology," in Proc. IEEE ECTC, pp. 1007-1011, May, 2002.
8. Dong-Wook Kim, et al, "High performance RF passive integration on Si smart substrate,", in Dig. IEEE Int. Microwave Sym. Vol. 3, pp. 1561-1564, June, 2002
9. G. Carchon, et al., "Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits," IEEE Tran. MTT. 24, pp. 510-519, 2001.
10. A. Sutono, et al., "High-Q LTCC-based passive library for wireless system-on-package (SOP) module development," IEEE Tran. MTT, 49, pp. 1715-1724, 2001.
11. R. E. Collin, Foundations for micro-wave engineering. New York McGraw-Hill, 1992.
12. Richard K. Ulrich, Leonard W. Schaper, Integrated Passive Component Technology, John Wiley & Sons, New York, 2003.
13. A. Sutono, et al., "RF/Microwave characterization of multilayer ceramic-based MCM techonolgy," IEEE Tran. Adv. Packaging, vol. 22, No. 3, Aug. 1999.
14. KAI. Chang, RF and Microwave Wireless Systems, John Wiley & Sons, New York, 2000.
15. C. P. Wen, "Coplanar waveguide: A surface strip transmission lines suitable for nonreciprocal gyromagnetic device applications," IEEE Tran. MTT, vol. 17, no. 12, pp1087-1090. Dec. 1969.