Low-cost millimeter-wave transceiver module using SMD packaged MMICs

Conference Proceedings- European Microwave Conference

Volumn 3, Issue , 2004, Pages 1269-1272

  Van Heijningen, M ^a   Gauthier, G ^b  

^a TNO   (Netherlands)

^b THALES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMMUNICATION SYSTEMS; ELECTRIC LINES; FREQUENCIES; LOW TEMPERATURE OPERATIONS; MICROWAVES; MILLIMETER WAVES; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

ELECTRICAL PARAMETERS; ORGANIC PACKAGE; SUBSTRATE MATERIALS; SURFACE MOUNT ASSEMBLY FOR COMMUNICATION K-BAND SYSTEMS (SMACKS);

TRANSCEIVERS;

EID: 18844394284     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M. Opperman, "Microwave and Millimeterwave Transceivers for Radio Links and LMDS Communications- The Challenges for Technology and Packaging Strategy", Proc. Int. Conf. on High-Density Interconnect and Systems Packaging, pp. 143- 148, 2001.
2. K. Beilenhoff, P. Quentin, S. Tranchant, O. Vaudescal, M. Parisot and H. Daembkes, "Full 26 GHz Chipset for Telecom Applications in SMD-Type Packages", Proc. of the European Gallium Arsenide and other Semiconductors Application Symp. (GAAS2002), pp. 331-334, September 2002.
3. H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, J. Williams and S. Peak, "Ku-Band MMICs in Low-Cost, SMT Compatible Packages", IEEE MTT-S Int. Microwave Symp. Dig., pp. 27-30, 2002
4. A. Bessemoulin, M. Parisot and M. Camiade, "1-Watt Ku-band Power Amplifier MMICs using Low-cost Quad-Flat Plastic Package", IEEE MTT-S Int. Microwave Symp. Dig., pp. 473-476, 2004.
5. F.J. Ortega-González, A. Asensio-López and G. Torregrosa-Penalva, "Low cost millimeter wave transmitter based on SMT techniques", Proc. of the European Microwave Conference, vol. 3, pp. 157-160, September 2001.
6. http://www.harvardthermal.com/products/TAS/TAS.htm