Yield improvement for anodic bonding with suspending structure

Sensors and Actuators, A: Physical

Volumn 143, Issue 2, 2008, Pages 462-468

  Yu, Hongbin ^a   Zhou, Guangya ^a   Chau, Fook Siong ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Anodic bonding; MEMS; Snap down; Suspending structure

Indexed keywords

ELECTRIC POTENTIAL; ELECTRODES; ELECTROSTATIC ACTUATORS; ELECTROSTATIC FORCE;

ANODIC BONDING; METAL LAYERS; PYREX SUBSTRATE; SUSPENDING STRUCTURE;

MEMS;

EID: 41349109952     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.11.009     Document Type: Article

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