Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 358-367

  Hossain, Mohammad M ^a   Agonafer, Dereje ^a   Viswanadham, Puligandla ^b   Reinikainen, Tommi ^b  

^a University of Texas at Arlington   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Accelerated Thermal Cycling; Fatigue Life; Finite Element Modeling; Intermetallic Compounds; Solder Joint Reliability

Indexed keywords

PLASTIC STRAIN; RAPID DESIGN OPTIMIZATION;

COMPUTER SIMULATION; CREEP; CYCLIC LOADS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERMETALLICS; MATHEMATICAL MODELS; OPTIMIZATION; SHEAR STRESS; STRAIN; STRESS CONCENTRATION;

SOLDERED JOINTS;

EID: 4444298609     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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