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Volumn 85, Issue 4, 2004, Pages 651-653
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Strain measurements by convergent-beam electron diffraction: The importance of stress relaxation in lamella preparations
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Author keywords
[No Author keywords available]
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Indexed keywords
CRYSTALLINE MATERIALS;
ELECTRON MICROSCOPY;
FINITE ELEMENT METHOD;
INTEGRATED CIRCUITS;
ION BEAMS;
MICROELECTRONICS;
MOSFET DEVICES;
NICKEL;
POLYCRYSTALLINE MATERIALS;
SILICON;
STRAIN MEASUREMENT;
STRESS RELAXATION;
SUBSTRATES;
THERMAL EFFECTS;
CONVERGENT-BEAM ELECTRON DIFFRACTION (CBED) PATTERNS;
LOCAL CRYSTAL ROTATIONS;
MONOCRYSTALLINE SILICON SUBSTRATES;
ELECTRON DIFFRACTION;
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EID: 4043091241
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.1774275 Document Type: Article |
Times cited : (149)
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References (13)
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