The bonding of Sn-Zn-Ag-Al-Ga lead-free solder balls on Cu/Ni-P/Au BGA substrate

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 692-695

  Lin, Kwang Lung ^a   Chiu, Ying Ta ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; HIGH TEMPERATURE OPERATIONS; INTERMETALLICS; SHEAR STRENGTH; SUBSTRATES;

BALL GRIDS; SHEAR TESTS; THERMAL AGING;

SOLDERING ALLOYS;

EID: 24644519512     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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9. R.Hultgren, P.D Desai, D.T. Hawkins, M.Gleioser, and K.K.Kelley, Selected Values of Thermodynamic Properties of Binary Alloys, Metals Park, OH: ASM, 1973,pp.333-339
10. R.Hultgren, P.D Desai, D.T. Hawkins, M.Gleioser, and K.K.Kelley, Selected Values of Thermodynamic Properties of Binary Alloys, Metals Park, OH: ASM, 1973. pp.5-7.