Grain boundary structure of ultrafine grained pure copper fabricated by accumulative roll bonding

Materials Transactions

Volumn 49, Issue 1, 2008, Pages 24-30

  Ikeda, Ken Ichi ^a   Yamada, Kousuke ^a,c   Takata, Naoki ^b   Yoshida, Fuyuki ^a,d   Nakashima, Hideharu ^a   Tsuji, Nobuhiro ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c FUJI HEAVY INDUSTRIES LTD   (Japan)

^d Nakayama Steel Works Ltd   (Japan)

Author keywords

Accumulative roll bonding; Copper; Grain boundary structure; High resolution electron microscopy; Structural unit model

Indexed keywords

COMPUTER SIMULATION; GRAIN BOUNDARIES; GRAIN GROWTH; HIGH RESOLUTION ELECTRON MICROSCOPY; ROLL BONDING;

ACCUMULATIVE ROLL BONDING (ARB); GRAIN BOUNDARY STRUCTURE; GRAINED PURE COPPER (CU);

COPPER;

EID: 39549121283     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.ME200715     Document Type: Article

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