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Volumn 2007, Issue , 2007, Pages 159-162

Characterization and modeling of CMOS on-chip coupled interconnects

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CHIP SCALE PACKAGES; ELECTRIC LINES; INDUCTANCE; INTERCONNECTION NETWORKS; SCATTERING PARAMETERS; SUBSTRATES;

EID: 39549105793     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.2007.4430903     Document Type: Conference Paper
Times cited : (3)

References (11)
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  • 3
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  • 4
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    • A simplified transmissionLine based crosstalk noise model for on-chip RLC wiring
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  • 5
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    • Loop based inductance extraction and modeling for multi-conductor on-chip interconnects
    • Jan
    • S. Yu, D. M. Petranovic, S. Krishnan, K. Lee and Cary Y. Yang, "Loop based inductance extraction and modeling for multi-conductor on-chip interconnects," IEEE Trans. ED, vol. 53, pp. 135-145, Jan. 2006.
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  • 7
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    • New formulas of interconnect capacitances based on results of conformal mapping method
    • Jan
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    • (2000) IEEE Transactions on Electron Devices , vol.47 , Issue.1 , pp. 222-231
    • Stellari, F.1    Lacaita, L.A.2
  • 8
    • 0001032562 scopus 로고
    • Inductance calculations in a complex integrated circuit environment
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    • E. Ruehli, "Inductance calculations in a complex integrated circuit environment,"IBM J R and D, pp. 470-481, Sept, 1972.
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    • Ruehli, E.1
  • 9
    • 0036589345 scopus 로고    scopus 로고
    • Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate
    • A. Weisshaar, H. Lan and A. Luoh, "Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate," IEEE Trans. Advanced Packag., vol. 25, pp. 288-296, 2002.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.