Flip-chip underfill packaging considering capillary force, pressure difference, and inertia effects

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 48-55

  Lin, Chao Ming ^a   Chang, Win Jin ^b   Fang, Te Hua ^c  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

^b KUN SHAN UNIVERSITY   (Taiwan)

^c NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Capillary force; Flip chip packaging; Pressure difference; Rotation; Underfill

Indexed keywords

CAPILLARY FLOW; FLIP CHIP DEVICES; PRESSURE EFFECTS; REDUCTION; SURFACE TENSION;

CAPILLARY FORCE; FLIP-CHIP PACKAGING; PRESSURE DIFFERENCE;

ELECTRONICS PACKAGING;

EID: 38849137404     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429709     Document Type: Article

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