Advanced encapsulant systems for flip-chip-on-board assemblies: underfills with improved manufacturing properties

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 3, 1998, Pages 196-203

  Gamota, D R ^a   Melton, C M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT CHIP ATTACH;

ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MANUFACTURE; PERFORMANCE; RELIABILITY;

ENCAPSULATION;

EID: 0032108615     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.720417     Document Type: Article

References (14)