Enhancement of underfill capillary flow in flip-chip packaging by means of the inertia effect

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 3, 2004, Pages 533-539

  Lin, Chao Ming ^a  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CAPILLARY FLOW; CONTACT ANGLE; ENCAPSULATION; FILLERS; FLIP CHIP DEVICES; MATHEMATICAL MODELS; PHASE INTERFACES; ROTATIONAL FLOW; WETTING;

AVERAGE FLUID VELOCITY; FILLING TIME; FLIP CHIP PACKAGING; INERTIA EFFECT; ROTATION ENHANCED UNDERFILL PACKAGING (REUP); UNDERFILL CAPILLARY; WEBER NUMBER; WORKING DISK;

CHIP SCALE PACKAGES;

EID: 7244260270     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831846     Document Type: Article

References (13)

1. R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook. New York: Van Nostrand Reinhold, 1989, pp. 366-391.
2. J. Lau, Low Cost Flip Chip Technologies. New York: McGraw-Hill, 1996, pp. 1-17.
3. M. Kelly and J. Lau, "Low cost solder bumped flip-chip MCM-L demonstration," Circuit World, vol. 21, no. 3, pp. 25-28, Mar. 1995.
4. B. Wun and J. Lau, "Characterization and evaluation of the underfill encapsulants for flip chip assembly," Circuit World, vol. 21, no. 4, pp. 14-17, July 1995.
5. K. Banerji, "Vacuum infiltration of underfill material for flip-chip devices," U.S. Patent 5 203 076, Apr. 20, 1993.
6. Y. Guo, G. L. Lehmann, T. Driscoll, and E. J. Cotts, "A model of the underfill flow process: Particle distribution effects," in Proc. IEEE Electronic Components Technology Conf., 1999, pp. 71-76.
7. D. R. Gamota and C. M. Melton, "Advanced Encapsulant Systems for Flip-Chip-on-Board Assemblies: Underfills with Improved Manufacturing Properties," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 21, pp. 196-203, July 1998.
8. K. S. Mattew and H. L. William, "Underfill flow as viscous flow between parallel plates driven by capillary action," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 19, pp. 133-137, Apr. 1996.
9. G. L. Lehmann, T. E. Driscoll, P. C. Li, and E. J. Cotts, " Investigation of the fow behavior of particulate filled fluids," in Proc. Mater. Res. Soc. Symp., vol. 445, 1997, pp. 69-74.
10. G. L. Lehmann, E. J. Cotts, T. Driscoll, N. R. Guydosh, and P. Li, "Underflow process for direct-chip-attachment packaging," in Proc. 1st IEEE Int. Symp. Polym. Electron. Packag., 1997, pp. 273-283.
11. F. M. White, Fluid Mechanics. New York: McGraw-Hill, 1979.
12. P. S. de Laplace, Traite de Mechanique Celeste, Paris, France: Bachelier, 1829.
13. K. Zhang and A. Activos, "Viscous resuspension in fully developed laminar pipe flow," Int. J. Multiphase Flow, vol. 20, no. 3, pp. 579-591, 1994.