The evolution of residual stresses in thermoplastic bonding to metals

International Journal of Adhesion and Adhesives

Volumn 17, Issue 4, 1997, Pages 353-357

  Ramani, Karthik ^a   Zhao, Wenping ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Elastic viscoelastic; Residual stress; Thermoplastic adhesive bonding

Indexed keywords

AMORPHOUS FILMS; COOLING; MATHEMATICAL MODELS; POLYETHER ETHER KETONES; RESIDUAL STRESSES; STRIP METAL; THIN FILMS; VISCOELASTICITY;

SEMI CRYSTALLINE THERMOPLASTIC THIN FILMS; THERMOPLASTIC BONDING;

ADHESIVE JOINTS;

EID: 0031271875     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(97)00030-4     Document Type: Article

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