SCOPUS 정보 검색 플랫폼

International SAMPE Technical Conference

Volumn 33, Issue , 2001, Pages 356-368

Process optimization for reduction of composite patch repair residual stresses

(4) Djokic, Drazen a Hojjati, Mehdi a Johnston, Andrew a Lee Sullivan, Pearl a

Author keywords

Film adhesives; Process modeling; Repair; Viscoelasticity

Indexed keywords

ADHESIVES; ALUMINUM; COMPUTER SIMULATION; CURING; DEFORMATION; GLASS TRANSITION; OPTIMIZATION; POLYMERS; REPAIR; RESIDUAL STRESSES; TEMPERATURE; VISCOELASTICITY;

COMPOSITE PATCH REPAIR RESIDUAL STRESSES; DEGREE OF CURE; FILM ADHESIVES; POTENTIAL ADHESIVE CURE CYCLE; VISCOELASTIC CONSTITUTIVE MODEL; WARPAGE;

COMPOSITE MATERIALS;

EID: 0035717780 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (6)

References (15)

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2
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- Ong, C.L.¹ Shen, S.²

3
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- Cho, J.¹ Sun, C.T.²

4
- 0008487033
- Composites: Part A
- Djokic, D.¹ Johnston, A.² Rogers, A.³ Lee-Sullivan, P.⁴ Mrad, N.⁵

5
- 4243717773
- Closed form solution for stress development in a simple single-sided bonded patch repair
- Internal Report, in preparation, Institute for Aerospace Research, National Research Council of Canada, Ottawa, Ontario, Canada
- Hojjati, M.¹ Johnston, A.²

6
- 0003802663
- Thermal residual stresses in bonded composite repairs on cracked metal structures
- Ph.D. Thesis, The University of British Columbia, Dept. of Mech. Eng., Vancouver, BC, Canada
- (1998)
- Albat, A.M.¹

7
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- McGraw-Hill
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- Young, W.C.¹

8
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- Proceedings of the Third Canadian International Composites Conference CANCOM 2001, Montreal, QC, Canada, August 2001
- Hojjati, M.¹ Johnston, A.² Cole, K.C.³

9
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- John Wiley and Sons, New York
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- Ferry, J.D.¹

10
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- Marcel Dekker, Inc.
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11
- 0030379041
- (1996) Polymer Engineering and Science , vol.36 , Issue.23 , pp. 2852
- Kim, Y.K.¹ White, S.R.²

12
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- Internal Report, in preparation, Institute for Aerospace Research, National Research Council of Canada, Ottawa, Ontario, Canada
- Viscoelastic Behavior of Cytec FM73 Adhesive During Cure
- Hojjati, M.¹ Johnston, A.²

13
- 0008502911
- Stress relaxation behavior of cytec FM73 adhesive during cure
- Proceedings of the Third Canadian International Composites Conference CANCOM 2001, Montreal, QC, Canada, August 2001
- Hojjati, M.¹ Johnston, A.² Denault, J.³ Hoa, S.V.⁴

14
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- Flugge, W.¹

15
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- LTR-SMPL-2000-0193, Institute for Aerospace Research, National Research Council of Canada, Ottawa, ON, Canada
- (2000) Modelling of Residual Stress Development During Composite Patch Repair of Metallic Structures: A Literature Review
- Xiao, X.¹ Hojjati, M.² Johnston, A.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.