Heat-transfer characteristics and design optimization for a small-sized plate-fin heat sink array

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 518-521

  Xu, Gaowei ^a   Cheng, Yingjun ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Empirical design rule; Heat transfer; Plate fin heat sink array; Revised biot criterion; Thermal resistance model

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; SUPERCOMPUTERS;

EMPIRICAL DESIGN RULES; PLATE FIN HEAT SINK ARRAYS; REVISED BIOT CRITERION;

HEAT SINKS;

EID: 38749134855     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804102     Document Type: Article

References (9)

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