Thermal/fluid performance evaluation of serrated plate fin heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 267-275

  Shwaish, Ibraheem K ^a   Amon, Cristina H ^a   Murthy, Jayathi Y ^b  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b Purdue University   (United States)

Author keywords

Electronics cooling; Enclosed heat sink; Forced convection; Numerical simulation; Plate fin; Serrated fin; Staggered fins; Turbulent convection

Indexed keywords

COMPUTER SIMULATION; COOLING; ENERGY DISSIPATION; FORCED CONVECTION; HYDRODYNAMICS; MICROELECTRONICS; NUSSELT NUMBER; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; TURBULENT FLOW;

ELECTRONICS COOLING;

FINS (HEAT EXCHANGE);

EID: 0036459821     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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