System-level thermal management modeling of a supercomputer chassis

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 88-93

  Xu, Gaowei ^a   Cheng, Yingjun ^a   Zhu, Dapeng ^a   Lin, Xiaoqin ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; COOLING; FINITE ELEMENT METHOD; HEAT LOSSES; LOGIC DESIGN; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; PRINTED CIRCUIT BOARDS;

FINITE ELEMENT THERMAL MODELS; FORCED WIND COOLING; SUPERCOMPUTER CHASSIS; THERMAL MANAGEMENT MODELING;

SUPERCOMPUTERS;

EID: 33846273081     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564697     Document Type: Conference Paper

References (5)

1. Bruce Boyer. Thermal Management in Embedded PC Systems. Kontrom America Corporation. 2002.
2. FLOTHERM website: www.flotherm.com.
3. Todd A. Newhouse. CFD System Level Modeling of a Large Telecommunications Enclosure.
4. G. Venkata Krishnan. Mechanical Considerations in Electronics Packaging, IEEE CPMT Society Bangalore Capter Meeting, Bangalore (India), 2005.
5. Peter Rodgers, Valerie Eveloy. Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements.