메뉴 건너뛰기




Volumn 38, Issue 6, 2007, Pages 1050-1054

Properties and welding interface characterization of new-type Au-Ag-Ge brazing alloy

Author keywords

Au Ag Ge; Brazing alloy; Intermetallic; Welding interface; Wettability

Indexed keywords

BRAZING; CHARACTERIZATION; GERMANIUM ALLOYS; GOLD ALLOYS; INTERFACES (MATERIALS); INTERMETALLICS; MELTING; MELTING POINT; MICROSTRUCTURE; NICKEL; SHEAR STRENGTH; SILVER ALLOYS; WELDING;

EID: 38649091037     PISSN: 16727207     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (7)

References (17)
  • 3
    • 33846060769 scopus 로고    scopus 로고
    • Properties and interface microstructure of new type Ag-Cu-Ge solder
    • YUE Yi-xin, TAN Cheng-yu, ZHENG Zi-qiao, et al. Properties and interface microstructure of new type Ag-Cu-Ge solder [J]. The Chinese Journal of Nonferrous Metals, 2006, 16 (10): 1793-1798.
    • (2006) The Chinese Journal of Nonferrous Metals , vol.16 , Issue.10 , pp. 1793-1798
    • Yue, Y.-X.1    Tan, C.-Y.2    Zheng, Z.-Q.3
  • 4
    • 17244364084 scopus 로고    scopus 로고
    • Study of a new-type of Au-Ag-Si intermediate temperature eutectic solder
    • MO Wen-jian, WANG Zhi-fa, JIANG Guo-sheng, et al. Study of a new-type of Au-Ag-Si intermediate temperature eutectic solder [J]. Rare Metal Material and Engineering, 2005, 34 (3): 497-500.
    • (2005) Rare Metal Material and Engineering , vol.34 , Issue.3 , pp. 497-500
    • Mo, W.-J.1    Wang, Z.-F.2    Jiang, G.-S.3
  • 7
    • 0347608298 scopus 로고    scopus 로고
    • Nonequilibrium growth of intermetallics at the interface of liquid-solid metal
    • LAO Bang-sheng, GAO Shu, ZHANG Qi-yun. Nonequilibrium growth of intermetallics at the interface of liquid-solid metal [J]. Acta Phys-Chim Sin, 2001, 17 (5): 453-456.
    • (2001) Acta Phys-Chim Sin , vol.17 , Issue.5 , pp. 453-456
    • Lao, B.-S.1    Gao, S.2    Zhang, Q.-Y.3
  • 8
    • 24644505927 scopus 로고    scopus 로고
    • Morphology and strength of TC4/TC4 joint with 72Ag-28Cu filler metal
    • JIANG Cheng-yu, WU Ming-fang, YU Chun, et al. Morphology and strength of TC4/TC4 joint with 72Ag-28Cu filler metal [J]. Rare Metal Materials and Engineering, 2003, 32 (4): 295-297.
    • (2003) Rare Metal Materials and Engineering , vol.32 , Issue.4 , pp. 295-297
    • Jiang, C.-Y.1    Wu, M.-F.2    Yu, C.3
  • 9
    • 27944490491 scopus 로고    scopus 로고
    • Effect of Ni on reactive diffusion between Au and Sn at solid-state temperatures
    • Mita M, Miura K, Takenaka T, et al. Effect of Ni on reactive diffusion between Au and Sn at solid-state temperatures [J]. Materials Science and Engineering, 2006, 126 (1): 37-43.
    • (2006) Materials Science and Engineering , vol.126 , Issue.1 , pp. 37-43
    • Mita, M.1    Miura, K.2    Takenaka, T.3
  • 10
    • 13444252734 scopus 로고    scopus 로고
    • 3Sn particles on the intermetallic compounds during wetting reaction
    • 3Sn particles on the intermetallic compounds during wetting reaction [J]. J Alloy Comp, 2005, 389: 153-158.
    • (2005) J Alloy Comp , vol.389 , pp. 153-158
    • Yu, D.Q.1    Wang, L.2    Wu, C.M.L.3
  • 11
    • 0037036037 scopus 로고    scopus 로고
    • Prediction of primary intermetallic compound formation during interfacial reaction between Sn-rich solder and Ni substrate
    • Choi W K, Lee H M. Prediction of primary intermetallic compound formation during interfacial reaction between Sn-rich solder and Ni substrate [J]. Scripta Materialia, 2002, 46 (11): 777-781.
    • (2002) Scripta Materialia , vol.46 , Issue.11 , pp. 777-781
    • Choi, W.K.1    Lee, H.M.2
  • 12
    • 0142165074 scopus 로고    scopus 로고
    • Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint
    • Li G Y, Chen B L. Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint [J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26 (3): 651-658.
    • (2003) IEEE Transactions on Components and Packaging Technologies , vol.26 , Issue.3 , pp. 651-658
    • Li, G.Y.1    Chen, B.L.2
  • 13
    • 0036680574 scopus 로고    scopus 로고
    • Influence of intermetallic compounds on the adhesive strength of solder joints
    • Lee H T, Chen M H. Influence of intermetallic compounds on the adhesive strength of solder joints [J]. Materials Science and Engineering A, 2002, A333 (1/2): 24-34.
    • (2002) Materials Science and Engineering A , vol.A333 , Issue.1-2 , pp. 24-34
    • Lee, H.T.1    Chen, M.H.2
  • 14
    • 0033904050 scopus 로고    scopus 로고
    • Solder joint fatigue models: Review and applicability to chip scale packages
    • Lee W W, Nguyen L T, Selvaduray G S. Solder joint fatigue models: Review and applicability to chip scale packages [J]. Microelectronics Reliability, 2000, 40: 213-244.
    • (2000) Microelectronics Reliability , vol.40 , pp. 213-244
    • Lee, W.W.1    Nguyen, L.T.2    Selvaduray, G.S.3
  • 15
    • 33745659940 scopus 로고    scopus 로고
    • Analyses of interfacial reactions at different levels of interconnection
    • Laurila T, Vuorinen V, Kivilahti J K. Analyses of interfacial reactions at different levels of interconnection [J]. Mater Sci Eng A, 2004, 37: 307-317.
    • (2004) Mater Sci Eng A , vol.37 , pp. 307-317
    • Laurila, T.1    Vuorinen, V.2    Kivilahti, J.K.3
  • 16
    • 0142137826 scopus 로고    scopus 로고
    • Influence of interfacial intermetallic compound on fracture behavior of solder joints
    • Lee H T, Chen M H, Jao H M, et al. Influence of interfacial intermetallic compound on fracture behavior of solder joints [J]. Materials and Engineering A, 2003, A358 (1/2): 134-141.
    • (2003) Materials and Engineering A , vol.A358 , Issue.1-2 , pp. 134-141
    • Lee, H.T.1    Chen, M.H.2    Jao, H.M.3
  • 17
    • 0035877138 scopus 로고    scopus 로고
    • Microsfructure and intermetalic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
    • Pang H L J, Tan K H, Shi X Q, et al. Microsfructure and intermetalic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging [J]. Materials Science and Engineering, 2001, A307: 42-50.
    • (2001) Materials Science and Engineering , vol.A307 , pp. 42-50
    • Pang, H.L.J.1    Tan, K.H.2    Shi, X.Q.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.