-
3
-
-
33846048823
-
A primary study of Au-Ag-Si solder
-
MO Wen-jian, WANG Zhi-fa, WANG Hai-shan, et al. A primary study of Au-Ag-Si solder[J]. Precious Metals, 2004, 25(5): 45-51.
-
(2004)
Precious Metals
, vol.25
, Issue.5
, pp. 45-51
-
-
Mo, W.-J.1
Wang, Z.-F.2
Wang, H.-S.3
-
4
-
-
17244364084
-
Study of a new-type of Au-Ag-Si intermediate temperature eutectic solder
-
MO Wen-jian, WANG Zhi-fa, JIANG Guo-sheng, et al. Study of a new-type of Au-Ag-Si intermediate temperature eutectic solder[J]. Rare Metal Material and Engineering, 2005, 34(3): 497-500.
-
(2005)
Rare Metal Material and Engineering
, vol.34
, Issue.3
, pp. 497-500
-
-
Mo, W.-J.1
Wang, Z.-F.2
Jiang, G.-S.3
-
6
-
-
0042779151
-
-
Beijing: National Defence Industry Press
-
ZHUANG Hong-shou. High temperature brazing[M]. Beijing: National Defence Industry Press, 1989: 121-123.
-
(1989)
High Temperature Brazing
, pp. 121-123
-
-
Zhuang, H.-S.1
-
7
-
-
0033149165
-
Intermetallic phase formation and shear strength of a Au-In microjoint
-
Shieu F S, Chen C F, Sheen J G, et al. Intermetallic phase formation and shear strength of a Au-In microjoint[J]. Thin Solid Films, 1999, 346: 125-129.
-
(1999)
Thin Solid Films
, vol.346
, pp. 125-129
-
-
Shieu, F.S.1
Chen, C.F.2
Sheen, J.G.3
-
8
-
-
0035575899
-
Stacked solder bumping technology for improved solder joint reliability
-
LIU Xing-sheng, XU Shuang-yan, LU Guo-quan, et al. Stacked solder bumping technology for improved solder joint reliability[J]. Microelectronics Reliability, 2001, 41: 1979-1992.
-
(2001)
Microelectronics Reliability
, vol.41
, pp. 1979-1992
-
-
Liu, X.-S.1
Xu, S.-Y.2
Lu, G.-Q.3
-
9
-
-
0032671390
-
Intermediate temperature joining of dissimilar metals
-
Hosking F M, Stephensand J J, Rejent J A. Intermediate temperature joining of dissimilar metals[J]. Welding Research, 1999, 4(Suppl): 127.
-
(1999)
Welding Research
, vol.4
, Issue.SUPPL.
, pp. 127
-
-
Hosking, F.M.1
Stephensand, J.J.2
Rejent, J.A.3
-
10
-
-
33646750384
-
Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free sdder
-
WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, et al. Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free sdder[J]. The Chinese Journal of Nonferrous Metals, 2006, 16(1): 158-163.
-
(2006)
The Chinese Journal of Nonferrous Metals
, vol.16
, Issue.1
, pp. 158-163
-
-
Wu, W.-Y.1
Qiu, X.-M.2
Yin, S.-Q.3
-
11
-
-
33646878606
-
Microstructure of Sn-3.5Ag-0.5Cu/Cu interface
-
WANG Ye, HUANG Ji-hua, ZHANG Jian-gang, et al. Microstructure of Sn-3.5Ag-0.5Cu/Cu interface[J]. The Chinese Journal of Nonferrous metals, 2006, 16(3): 495-499.
-
(2006)
The Chinese Journal of Nonferrous Metals
, vol.16
, Issue.3
, pp. 495-499
-
-
Wang, Y.1
Huang, J.-H.2
Zhang, J.-G.3
-
12
-
-
33846060769
-
Properties and interface microstructure of new type Ag-Cu-Ge solder
-
YUE Yi-xin, TAN Cheng-yu, ZHENG Zi-qiao, et al. Properties and interface microstructure of new type Ag-Cu-Ge solder[J]. The Chinese Journal of Nonferrous Metals, 2006, 16(10): 1793-1798.
-
(2006)
The Chinese Journal of Nonferrous Metals
, vol.16
, Issue.10
, pp. 1793-1798
-
-
Yue, Y.-X.1
Tan, C.-Y.2
Zheng, Z.-Q.3
-
13
-
-
0035877138
-
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
-
Pang H L J, Tan K H, Shi X Q, et al. Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging[J]. Materials Science and Engineering, 2001, A307: 42-50.
-
(2001)
Materials Science and Engineering
, vol.A307
, pp. 42-50
-
-
Pang, H.L.J.1
Tan, K.H.2
Shi, X.Q.3
-
14
-
-
0025459116
-
The Ag-Au-Si system: Experimental and calculated phase diagram
-
Hassam S, Agren J, Gaune-eseard M, et al. The Ag-Au-Si system: Experimental and calculated phase diagram[J]. Metallurgical Transactions A, 1990, 21A: 1877.
-
(1990)
Metallurgical Transactions A
, vol.21 A
, pp. 1877
-
-
Hassam, S.1
Agren, J.2
Gaune-Eseard, M.3
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