Spin coating film transfer and hot-pressing system for uniform dielectric formation and its application to porous low-k film formation

Japanese Journal of Applied Physics

Volumn 47, Issue 1, 2008, Pages 113-118

  Kawagoe, Masafumi ^a   Adachi, Hideki ^a   Yanagida, Takaaki ^a   Komura, Tomoyuki ^a   Saito, Hidenori ^b   Sato, Norio ^c   Kudou, Kazuhisa ^d   Machida, Katsuyuki ^d  

^a DAINIPPON SCREEN MFG CO LTD   (Japan)

^b Sumitomo Bakelite Co Ltd   (Japan)

^c NTT CORPORATION   (Japan)

^d NTT Advanced Technology Corporation   (Japan)

Author keywords

Dielectric; Interconnection; Low k; Planarization; Sealing; STP system

Indexed keywords

DIELECTRIC FILMS; HOT PRESSING; SILICON WAFERS; SPIN COATING;

PATTERNED WAFERS; SPIN COATING FILM TRANSFER;

THIN FILMS;

EID: 38549123890     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.113     Document Type: Article

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