-
1
-
-
0037533920
-
A MEMS electromagnetic optical scanner for a commercial confocal laser scanning microscope
-
H. Miyajima, N. Asaoka, T. Isokawa, M. Ogata, Y. Aoki, M. Imai, O. Fujimori, M. Katashiro and K. Matsumoto, "A MEMS electromagnetic optical scanner for a commercial confocal laser scanning microscope", J. Microelectromech. Syst., Vol.12-3, pp.243-251(2003).
-
(2003)
J. Microelectromech. Syst
, vol.12 -3
, pp. 243-251
-
-
Miyajima, H.1
Asaoka, N.2
Isokawa, T.3
Ogata, M.4
Aoki, Y.5
Imai, M.6
Fujimori, O.7
Katashiro, M.8
Matsumoto, K.9
-
2
-
-
0033297078
-
-
T. Yi and C. Kim, Mesurement of mechanical properties for MEMS material, Meas. Sci. Technology, 10, pp.706-717 (1999).
-
T. Yi and C. Kim, "Mesurement of mechanical properties for MEMS material", Meas. Sci. Technology, Vol.10, pp.706-717 (1999).
-
-
-
-
3
-
-
0029292835
-
The electron charging effects of plasma on notch profile defects
-
T. Nozawa, T. Kinoshita, T. Nishizaka, A. Narai, T. Inoue and A. Nakaune, "The electron charging effects of plasma on notch profile defects", Jpn. J. Appl. Phys., Vol.34, pp.2107-2113 (1995).
-
(1995)
Jpn. J. Appl. Phys
, vol.34
, pp. 2107-2113
-
-
Nozawa, T.1
Kinoshita, T.2
Nishizaka, T.3
Narai, A.4
Inoue, T.5
Nakaune, A.6
-
4
-
-
0033327355
-
An inertial sensor thecnology using DRIE and wafer bonding with inter-connecting capability
-
K Ichihara, C-F. Yung, A Ayon and M. Schmidt, "An inertial sensor thecnology using DRIE and wafer bonding with inter-connecting capability", J. Microlelectomech. Syst., Vol.8-4, pp.403-408 (1999).
-
(1999)
J. Microlelectomech. Syst
, vol.8 -4
, pp. 403-408
-
-
Ichihara, K.1
Yung, C.-F.2
Ayon, A.3
Schmidt, M.4
-
5
-
-
33746637523
-
Developing of specimen and test method for strength analysis of MEMS
-
Transactions of the Japan Society of Mechanical Engineers
-
S.Izumi, C.W. Ping, M. Yamaguchi, S. Sakai, A. Suzuki and Y. Ueda, "Developing of specimen and test method for strength analysis of MEMS", Transactions of the Japan Society of Mechanical Engineers, Series A Vol.72-717, pp.720-727 (2006).
-
(2006)
Series A
, vol.72
, Issue.717
, pp. 720-727
-
-
Izumi, S.1
Ping, C.W.2
Yamaguchi, M.3
Sakai, S.4
Suzuki, A.5
Ueda, Y.6
-
6
-
-
0029292835
-
The electron charging effects of plasma on notch profile defects
-
T. Nozawa, T. Kinoshita, T. Nishizaka, A Narai, T. Inoue and A Nakaue, "The electron charging effects of plasma on notch profile defects", Jpn. J. Appl. Phys., Vol.34, pp.2107-2113 (1995).
-
(1995)
Jpn. J. Appl. Phys
, vol.34
, pp. 2107-2113
-
-
Nozawa, T.1
Kinoshita, T.2
Nishizaka, T.3
Narai, A.4
Inoue, T.5
Nakaue, A.6
-
7
-
-
0033327355
-
An inertial sensor technology using DRIE and wafer bonding with intercinnecting capability
-
K Ichihara, C-F. Yung, A Ayon and M. Schmidt, "An inertial sensor technology using DRIE and wafer bonding with intercinnecting capability", J. Microlelectomech. Syst Vol.84, pp.403-408 (1999).
-
(1999)
J. Microlelectomech. Syst
, vol.84
, pp. 403-408
-
-
Ichihara, K.1
Yung, C.-F.2
Ayon, A.3
Schmidt, M.4
-
8
-
-
0942289265
-
Technique for preventing stiction and notching effect on silicon-on insulter microstructure
-
J. Li, Q. Zhang, A Liu, W. Goh, J. Ahn and J. Vac., "Technique for preventing stiction and notching effect on silicon-on insulter microstructure", Sci. Technol. B21(6), pp.2530-2539 (2003).
-
(2003)
Sci. Technol
, vol.B21
, Issue.6
, pp. 2530-2539
-
-
Li, J.1
Zhang, Q.2
Liu, A.3
Goh, W.4
Ahn, J.5
Vac, J.6
-
9
-
-
4344612738
-
Robust SOI process without footing and its application to ultra high-performance microgyroscopes
-
J. Kim, S. Park, D. Kwak, H. Ku, W. Carr, J. Buss and D. Cho, "Robust SOI process without footing and its application to ultra high-performance microgyroscopes", Sensors and Actuators A114, pp.236-243 (2004).
-
(2004)
Sensors and Actuators
, vol.A114
, pp. 236-243
-
-
Kim, J.1
Park, S.2
Kwak, D.3
Ku, H.4
Carr, W.5
Buss, J.6
Cho, D.7
-
10
-
-
0032753082
-
Characterization of a time multiplexed inductivity coupled plasma etcher
-
A. Ayon, R. Broff, C. Lin, H. Sawin and M. Schmidt, " Characterization of a time multiplexed inductivity coupled plasma etcher", J. Electrochem. Sioc, Vol.146 (1), pp.339349 (1999).
-
(1999)
J. Electrochem. Sioc
, vol.146
, Issue.1
, pp. 339349
-
-
Ayon, A.1
Broff, R.2
Lin, C.3
Sawin, H.4
Schmidt, M.5
-
11
-
-
38549179553
-
-
STATISTICA Users Manual, StatSoft Inc
-
STATISTICA Users Manual, StatSoft Inc..
-
-
-
|