|
|
|
Volumn 2, Issue , 1996, Pages 1020-1036
|
|
BGA and CGA solder attachments: results of low-acceleration reliability test and analysis
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ADHESIVE JOINTS;
FAILURE (MECHANICAL);
HEAT TRANSFER;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT TESTING;
RELIABILITY;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
THERMAL EFFECTS;
BALL GRID ARRAYS;
COLUMN GRID ARRAYS;
CYCLIC TEMPERATURE EXTREMES;
ELECTRICAL INTERFACES;
HIGHER CYCLIC FREQUENCY;
ELECTRONICS PACKAGING;
|
|
EID: 0029696913
PISSN: 04700155
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (7)
|
|
References (32)
|
