The effect of fillet height and bondline thickness on the mechanical performance of a plastic package

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 416-420

  Rasiah, Ignatius J ^a   Breach, Christopher ^b  

^a HONEYWELL   (United States)

^b Northern Region Industrial Estate   (Thailand)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELASTIC MODULI; ELECTRONICS PACKAGING; PACKAGING MATERIALS;

ASSEMBLY HOUSE; BONDLINE THICKNESS; FORM FACTORS; LOW MODULUS; MECHANICAL PERFORMANCE; NEW DIMENSIONS; PLASTIC PACKAGES; RE-QUALIFICATION;

MODIFIED ATMOSPHERE PACKAGING;

EID: 3843114732     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904191     Document Type: Conference Paper

References (3)

1. Ron Leckie, "Final Manufacturing Trends: Test, Assembly & Packaging", Keynote address at Packcon 2000, Santa Clara, CA, Oct 2000, http://www.infras.com/Packcon2000/
2. W.T. Chen and T.B. Lim, "Future Trends and Roadmaps in Electronic Packaging", Proceedings of IMAPS'98 Singapore Microelectronics Packaging Conference, 1998
3. I.J. Rasiah and W.S. Leong, "The Influence of Fillet Height of a Low Modulus Die Attach on the Wirebondability of a Plastic Package", EPTC Conference, Singapore, 1998, pp. 291-5.