Wirebonding at higher ultrasonic frequencies: Reliability and process implications

Microelectronics Reliability

Volumn 43, Issue 1, 2003, Pages 141-153

  Charles Jr , H K ^a   Mach, K J ^a   Lehtonen, S J ^a   Francomacaro, A S ^a   DeBoy, J S ^a   Edwards, R L ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; ELECTRIC WIRE; FREQUENCIES; RELIABILITY; SHEAR STRENGTH; SUBSTRATES; ULTRASONICS;

WIREBONDING;

ELECTRONICS PACKAGING;

EID: 0037224606     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00118-X     Document Type: Article

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