Robust direct-write dispensing tool and solutions for micro/meso-scale manufacturing and packaging

Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

Volumn , Issue , 2007, Pages 715-721

  Li, B ^a   Church, K H ^a   Clark, P A ^a  

^a nScrypt Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PHOTORESIST PROCESSING; THICK METALLIC DEVICES;

CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; ELECTROPLATING; MEMS; PHYSICAL VAPOR DEPOSITION; ROBUST CONTROL;

MACHINE TOOLS;

EID: 37349105364     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/MSEC2007-31037     Document Type: Conference Paper

References (17)

1. st Century, Chia-Yi, Taiwan, August 10-15, 2002.
2. B. Li and Q. Chen, Solid micromechanical valves fabricated with in situ UV-LIGA assembled nickel. Sensors and Actuators A, 126(2006) 187-193.
3. T. Hsu, MEMS and Microsystems design and manufacture, McGraw-Hill, Boston, 2002.
4. R.R. Tummala. Fundamentals of Microsystems packaging, McGraw-Hill, New York, 2001.
5. nd edition, CRC Press, Boca Raton, 2002.
6. T.R. Hsu, MEMS packaging, Institute of Electrical Engineers, UK, 2004.
7. E. Sachlos and J.T. Czernuszka, Making tissue engineering scaffolds work. Review on the application of solid freeform fabrication technology to the production of tissue engineering scaffolds, European Cells and Materials, 5 (2003), 29-40.
8. K.F. Leong, C.M. Cheah, C.K. Chua, Solid freeform fabrication of three-dimensional scaffolds for engineering replacement tissues and organs, Biomaterials, 24 (2003), 2363-2378.
9. A.M. Kachurin, R.L. Stewart, K.H. Church, W.L. Warren, J.P. Fisher, A.G. Mikos, S. Kraeft and B. Chen, Directwrite construction of tissue-engineered scaffolds, MRS proceedings, 698 (2001), Q5.
10. C.M. Smith, A.L. Stone, R.L. Parkhill, R.L. Stewart, M.W. Simpkins, A.M. Kachurin, W.L.Warren and S.K. Williams, Three-dimensional Bioassembly tool for generating viable tissue-engineered constructs, Tissue Engineering, 10 (2004), 1566-1576.
11. T.R. Hsu, Packaging Design of Microsystems and meso-scale devices," IEEE Transactions on Advanced Packaging, 23 (2000), 596-601.
12. W.S.N. Trimmer, "Microrobots and Micromechanical Systems," Sensors & Actuators, 19 (1989), No. 3, 267-287.
13. B. Morgan, X. Hua, T. Iguchi, T. Tomioka, G.S. Oehrlein and R. Ghodssi, Substrate interconnect technologies for 3-D MEMS packaging, Microelectronic Engineering, 81 (2005), 106-116.
14. P. Monajemi, P.J. Joseph, P.A. Kohl and F. Ayazi, Wafer-level MEMS packaging via thermally released metalorganic membranes, Journal of Micromechanics and Microenging, 16 (2006), 742-750.
15. X. Zhu and D.M. Aslam, CVD diamond thin film technology for MEMS packaging, Diamond & Related Materials, 15 (2006), 254-258.
16. S. Choa, Reliability of MEMS packaging: vacuum maintenance and packaging induced stress, Microsystem Technologies, 11 (2005), 1432-1858.
17. C.A. Harper, Electronic Packaging and Interconnect Handbook, 2nd Edition, McGraw Hill, 1997.