Determination and utilization of AuSn solder creep properties to bond GaAs dice to diamond substrates

American Society of Mechanical Engineers, EEP

Volumn 18, Issue , 1996, Pages 61-66

  Chandran, B ^a   Schmidt, W F ^a   Gordon, M H ^a   Djkaria, R ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMOND SUBSTRATES; GALLIUM ARSENIDE DEVICES; GOLD TIN SOLDER;

COOLING; CRACKS; CREEP; DIAMONDS; GOLD COMPOUNDS; MATHEMATICAL MODELS; PLASTIC DEFORMATION; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICES; SOLDERED JOINTS; STRESS RELAXATION; SUBSTRATES;

BONDING;

EID: 0030393236     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)