A combined simulative and experimental approach to reliability optimization of MEMS

11th International Conference on Fracture 2005, ICF11

Volumn 5, Issue , 2005, Pages 3896-3901

  Wittler, O ^a   Keller, J ^b   Vogel, D ^c   Michel, B ^c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION MEASUREMENTS; DESIGN FOR RELIABILITY; DESIGN PHASIS; DESIGN PROCESS; DIGITAL IMAGE CORRELATIONS; EXPERIMENTAL APPROACHES; FAILURE BEHAVIOUR; FAILURE MECHANISM; GREY SCALE; INTEGRATED MATERIALS; MATERIAL SELECTION; MECHANICAL STRUCTURES; MICRO ELECTRO MECHANICAL SYSTEM; NANODAC; NEW DESIGN; PARAMETRIC SIMULATIONS; RELIABILITY ASSESSMENTS; RELIABILITY OPTIMIZATION; RELIABILITY PROBLEMS; SIMULATION METHODS;

COMPUTER AIDED DESIGN; MECHANICAL PROPERTIES; MEMS; RELIABILITY ANALYSIS; UNCERTAINTY ANALYSIS;

FRACTURE;

EID: 84869755990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Schindler-Saefkow F., Wittler O., Schacht R., Großer V. and Michel B., Thermal Behaviour of 3D MATCH-X Packages, 14th European Microelectronics Packaging Conference & Exhibition EMPC, Friedrichshafen, Germany, June 23-25, 2003, proceedings
2. Wunderle B., Auersperg J., Großer V., Kaulfersch E., Wittler O. and Michel B., Modular Parametric Finite Element Modelling for Reliability-Studies in Electronic and MEMS Packaging, 5th Symposium on Design, Test, Integration and Packaging of MEMS/MOMEMS DTIP, Mandelieu - La Napoule, France, May 5-7, 2003, proceedings, pp. 335-340
3. Wittler O., Manessis D., Sommer J.-P. and Michel B., Thermo-Mechanical Design Analysis of Wafer Level Packages, European Microelectronics and Packaging Symposium, Prague, June 16-18, 2004, proceedings
4. Wittler O., Sprafke P., Auersperg J., Michel B. and Reichl H., Fracture Mechanical Analysis of Cracks in Polymer Encapsulated Metal Structures, Polytronic 2001, Potsdam, Germany, October 21-24, 2001, proceedings, pp. 203-208
5. rd International Conference and Poster Exhibition Micro Materials, MicroMat 2000, Berlin, Germany, April 17-19, 2000, proceedings, pp. 537-540
6. rd International Conference and Poster Exhibition Micro Materials, MicroMat 2000, Berlin, Germany, April 17-19, 2000, proceedings, pp. 829-832
7. Keller J., Vogel. D., Bauer M., Michel B., NanoDAC - A Powerful Method for Nanomechanical Analysis of Polymeric Materials, Materialsweek 2002, München, Germany, September 30 - October 2, 2002, proceedings
8. Wunderle B., Schacht R., Wittler O., Michel B. and Reichl H., Thermal Performance, Mechanical Reliability and Technological Features of Different Cooling Concepts for High Power Chip Modules, 9th International Workshop on Thermal Investigations of ICs and Systems Therminic, Aix-en-Provence, France, September 24-26, 2003, proceedings, pp. 59-64
9. J. Puigcorbé, D. Vogel, B. Michel, A. Vilà, N. Sabaté, I. Gràcia, C. Cané, J.R. Morante: "AFM Analysis of High Temperature Degradation in MEMS Elements", MME'02, The 13th Micromechanics Europe Workshop, October 6-8, 2002, Sinaia, Romania