Yield improvement of 0.13 μm Cu/low-k dual-damascene interconnection by organic cleaning process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 1819-1822

  Kim, Nam Hoon ^a   Kim, Sang Yong ^b   Lee, Hyun Ki ^b   Lee, Kang Yeon ^c   Kim, Chang Il ^b   Chang, Eui Goo ^b  

^a Sungkyunkwan University   (South Korea)

^b Chung Ang University   (South Korea)

^c Chosun University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; MICROELECTRONICS; PERMITTIVITY; STATIC RANDOM ACCESS STORAGE;

CHEMICAL-MECHANICAL PLANARIZATION; ORGANIC CLEANING; ORGANIC RESIDUES; PARASITIC CAPACITANCE; PROCESS INTEGRATION;

DIELECTRIC MATERIALS;

EID: 37149001871     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2794049     Document Type: Article

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