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Volumn 516, Issue 5, 2008, Pages 779-784
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Hot wire chemical vapor processing (HWCVP) - A prospective tool for VLSI
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Author keywords
Application Specific Integrated Circuits (ASICs); Diffusion barriers; Hot wire chemical vapor process (HWCVP); Micro electro mechanical systems (MEMS)
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Indexed keywords
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
CHEMICAL VAPOR DEPOSITION;
DIFFUSION BARRIERS;
ELECTROMIGRATION;
MEMS;
VLSI CIRCUITS;
HOT WIRE CHEMICAL VAPOR PROCESS (HWCVP);
MICRO ELECTRO-MECHANICAL SYSTEMS (MEMS);
ULTRA THIN DIFFUSION BARRIERS;
DIELECTRIC FILMS;
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EID: 36749085114
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2007.06.088 Document Type: Article |
Times cited : (6)
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References (11)
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