Application of gamma distribution in electromigration for submicron interconnects

Journal of Applied Physics

Volumn 102, Issue 10, 2007, Pages

  Ming Tan, Cher ^a   Raghavan, Nagarajan ^b   Roy, Arijit ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; ELECTROMIGRATION; ESTIMATION; STATISTICAL METHODS;

LOGNORMAL DISTRIBUTION; RESISTANCE DEGRADATION PROFILES; SUBMICRON INTERCONNECTS;

GAMMA RAYS;

EID: 36649021139     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2809449     Document Type: Article

References (18)

1. D. J. Pierce and P. J. Brusius, Microelectron. Reliab. 37, 1053 (1997).
2. B. Li, C. Christiansen, J. Gill, and T. Sullivan, J. Appl. Phys. 100, 114516 (2006).
3. G. Levitin and A. Lisnianski, Multistate System Reliability: Assessment, Optimization and Applications (World Scientific, Singapore, 2003), Chap..
4. A. P. Dempster, N. M. Laird, and D. B. Rubin, J. R. Stat. Soc. Ser. B (Methodol.) 39 (1), 1 (1977).
5. S. Jiang and D. Kececioglu, IEEE Trans. Reliab. 41, 248 (1992).
6. H. Akaike, IEEE Trans. Autom. Control 19, 716 (1974).
7. T. Bucar, M. Nagode, and M. Fajdiga, Reliab. Eng. Syst. Saf. 84, 241 (2004).
8. P. A. Tobias and D. C. Trindade, Applied Reliability, 2nd ed. (Van Nostrand Reinhold, New York, 1995).
9. C. K. Hu, L. Gignac, and R. Rosenberg, Microelectron. Reliab. 46, 213 (2006).
10. L. Arnaud, R. Gonella, G. Tartavel, J. Torres, C. Gounelle, Y. Gobil, and Y. Morand, Microelectron. Reliab. 38, 1029 (1998).
11. C. Christiansen, B. Li, J. Gill, R. Filippi, and M. Angyal, IIRW Final Report, 2005, pp. 22-26.
12. C. E. Ebeling, An Introduction to Reliability and Maintainability Engineering (McGraw-Hill, New York, 1997).
13. S. M. Ross, Introduction to Probability Models (Elsevier, New York, 2006), Chap..
14. C. L. Gan, C. V. Thompson, K. L. Pey, W. K. Choi, H. L. Tay, B. Yu, and M. K. Radhakrishnan, Appl. Phys. Lett. 79, 4592 (2001).
15. C. M. Tan and A. Roy, Mater. Sci. Eng., R. 58, 1 (2007).
16. J. R. Black, IEEE Trans. Electron Devices 16, 338 (1969).
17. M. Shatzkes and J. R. Lloyd, J. Appl. Phys. 59, 3890 (1986).
18. E. A. Elsayed, Reliability Engineering (Prentice-Hall, Englewood Cliffs, NJ, 1996).