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Volumn , Issue , 2007, Pages 305-310
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Performance evaluation for three-dimensional networks-on-chip
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Author keywords
[No Author keywords available]
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Indexed keywords
EMBEDDED CORES;
PACKAGING DENSITY;
PERFORMANCE EVALUATION;
THREE-DIMENSIONAL NETWORKS-ON-CHIP;
COMPUTER ARCHITECTURE;
EMBEDDED SYSTEMS;
ENERGY DISSIPATION;
MICROPROCESSOR CHIPS;
SILICON COMPOUNDS;
THREE DIMENSIONAL;
INTEGRATED CIRCUITS;
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EID: 36349019639
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISVLSI.2007.79 Document Type: Conference Paper |
Times cited : (56)
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References (9)
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