Optimization of solder paste printability with laser inspection technique

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 361-365

  Okura, T ^a   Kanai, M ^a   Ogata, S ^a   Takei, T ^a   Takakusagi, H ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; INSPECTION; LASER APPLICATIONS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; QUALITY CONTROL; SCANNING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

LASER INSPECTION; PRINTABILITY; REFLOW SOLDERING; SOLDER PASTES;

SOLDERING;

EID: 0029475958     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)