Chemical mechanical planarization operation via dynamic programming

Microelectronic Engineering

Volumn 84, Issue 12, 2007, Pages 2817-2831

  Lin, Chia Shui ^a   Lee, Yung Chou ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical planarization; Copper dishing; Dynamic programming; Non planarization index; Oxide erosion

Indexed keywords

DYNAMIC PROGRAMMING; EROSION; FORCE CONTROL; OPTIMIZATION; PARAMETER ESTIMATION; SILICA; THICKNESS MEASUREMENT;

COPPER DISHING; NON-PLANARIZATION INDEX; OXIDE EROSION;

CHEMICAL MECHANICAL POLISHING;

EID: 36148983047     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.02.003     Document Type: Article

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