Copper film deposition and anode temperature measurements in a vacuum arc with tungsten anode

Surface and Coatings Technology

Volumn 202, Issue 4-7, 2007, Pages 925-930

  Beilis, I I ^a   Shnaiderman, A ^a   Shashurin, A ^a   Boxman, R L ^a   Goldsmith, S ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Anode temperature; Deposition rate; Film deposition; Macroparticle; Radial plasma expansion; Refractory tungsten anode; Vacuum arc

Indexed keywords

COPPER; DEPOSITION; OPTICAL MICROSCOPY; PROFILOMETRY; TEMPERATURE MEASUREMENT; THERMOCOUPLES;

ANODE TEMPERATURE; FILM DEPOSITION; RADIAL PLASMA EXPANSION; REFRACTORY TUNGSTEN ANODE;

METALLIC FILMS;

COPPER; DEPOSITION; METALLIC FILMS; OPTICAL MICROSCOPY; PROFILOMETRY; TEMPERATURE MEASUREMENT; THERMOCOUPLES;

EID: 36048991832     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.05.047     Document Type: Article

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