Fabrication and thermal analysis of a copper/diamond/copper thermal spreading device

Surface and Coatings Technology

Volumn 202, Issue 4-7, 2007, Pages 1208-1213

  Young, Tai Fa ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Adhesion; Diamond; Thermal conductivity; Thermal spreading

Indexed keywords

ADHESION; COPPER; DIAMONDS; HEAT RESISTANCE; SPUTTERING; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMOANALYSIS;

THERMAL SPREADING;

DIAMOND FILMS;

ADHESION; COPPER; DIAMOND FILMS; DIAMONDS; HEAT RESISTANCE; SPUTTERING; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMOANALYSIS;

EID: 36048944782     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.07.098     Document Type: Article

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