Deposition of uniform and well adhesive diamond layers on planar tungsten copper substrates for heat spreading applications

Materials Science and Engineering: B

Volumn 127, Issue 2-3, 2006, Pages 186-192

  Glaser, A ^a   Jentsch, H G ^a   Rosiwal, S M ^a   Ludtke A ^b   Singer, R F ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^b Polese Co   (United States)

Author keywords

Adhesion; Diamond; Surface and interface states; Surface stress; Thermal properties; Tungsten

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; COPPER; DEPOSITION; GEOMETRY; HEAT TRANSFER; SURFACE CHEMISTRY; TUNGSTEN;

MICROWAVE PLASMA; SURFACE AND INTERFACE STATES; SURFACE STRESS; THERMAL PROPERTIES;

DIAMONDS;

EID: 31144470591     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2005.10.018     Document Type: Article

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