New evaluation method of CSPs board level reliability using strain gauge

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1398-1404

  Yamaji, Yasuhisa ^a   Suzuki, Takehiro ^a   Yamasaki, Hirofumi ^a   Ohishi, Tsukasa ^a   Chikawa, Yasunori ^a   Kako, Noritoshi ^a  

^a SHARP CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CELLULAR RADIO SYSTEMS; ELECTRONICS PACKAGING; IMPACT TESTING; PRINTED CIRCUIT BOARDS; STRAIN GAGES; STRESS ANALYSIS; THERMAL CYCLING; THERMAL STRESS; VIBRATIONS (MECHANICAL);

BOARD LEVEL RELIABILITY; CELLULAR PHONES; MECHANICAL STRESS TESTING;

CHIP SCALE PACKAGES;

EID: 0034484279     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)