Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 1928-1949

  Nakadaira, Yoshikuni ^a   Jeong, Seyoung ^a   Shim, Jongbo ^a   Seo, Jaiseok ^a   Min, Sunhee ^a   Cho, Taeje ^a   Kang, Sayoon ^a   Oh, Seyong ^a  

^a Technology Development Team   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; ELECTRONICS PACKAGING; GRAIN BOUNDARIES; TEMPERATURE MEASUREMENT; THERMAL CYCLING; TIN;

EPOXY MOLD COMPOUND (EMC); IONIC CONTAMINANTS; LEADFRAME PACKAGES; TIN WHISKERS;

CRYSTAL WHISKERS;

EID: 35548933651     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.03.008     Document Type: Article

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