Microstructure-based stress modeling of tin whisker growth

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 137-144

  Zhao, Jie Hua ^a   Su, Peng ^a   Ding, Min ^b   Chopin, Sheila ^a   Ho, Paul S ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

STRAIN ENERGY DENSITY (SED); STRESS MODELING; THERMAL EXPANSION ANISOTROPY; WHISKER DENSITY;

ANISOTROPY; COATINGS; COPPER; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; STRESS ANALYSIS; THERMAL EXPANSION; TIN;

CRYSTAL WHISKERS;

EID: 24644457796     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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