Optimal Ni/Co thickness extraction and two step rapid thermal process of the nickel-silicide for nanoscale complementary metal oxide semiconductor (CMOS) application

Extended Abstracts of the Fourth International Workshop on Junction Technology, IWJT 2004

Volumn 4, Issue , 2004, Pages 127-130

  Yun, Jang Gn ^a   Oh, Soon Young ^a   Ji, Hee Hwan ^a   Huang, Bin Feng ^a   Park, Young Ho ^b   Park, Seong Hyung ^b   Lee, Heui Seung ^b   Kim, Dae Byung ^b   Kim, Ui Sik ^b   Cha, Han Seob ^b   Hu, Sang Bum ^b   Lee, Jeong Gun ^b   Lee, Hi Deok ^a  

^a Chungnam National University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ION IMPLANTATION; LEAKAGE CURRENTS; NICKEL COMPOUNDS; RAPID THERMAL ANNEALING; SEMICONDUCTOR JUNCTIONS; THERMODYNAMIC STABILITY;

SHEET RESISTANCES; THICKNESS EXTRACTION; ULTRA-SHALLOW JUNCTIONS;

CMOS INTEGRATED CIRCUITS;

EID: 3543136086     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Conference Paper

References (11)

1. M. Y. Wang, C. W. Chang, C. M. Wu, C. T. Lin, C. H. Hsieh, Winston S. Shue, and M. S. Liang, 2003 Symposium on VLSI Technology Dig. (Kyoto, Japan, 2003) p. 157.
2. X. P. Qu, C. Detavernier, R. L. Van Meirhaeghe, and F. Cardon, Mat. Res. Soc. Symp. Proc. 670, (2001) K6.10.1.
3. L. W. Cheng, S. L. Cheng, J. Y. Chen, L. J. Chen, and B. Y. Tsui, Thin Solid Films 355, (1999) 412.
4. P. S. Lee, D. Mangelinck, K. L. Pey, J. Ding. D. Z. Chi, J. Y. Dai, and A. See, J. Electron. Mater. 30, (2001) 1554.
5. W. L. Tan, K. L. Pey, Simon Y. M. Chooi, and J. H. Ye, Mat. Res. Soc. Symp. Proc.670, (2001) K6.6.1.
6. D. Mangelinck, P. Gas, J. M. Gay, and B. Pichaud and O. Thomas, J. Appl. Phys. 84, (1998) 2583.
7. Y. W. Ok, C. J. Choi, and T. Y. Seong, J. Electrochem. Soc. 150, (2003) G385.
8. M. J. Kim, H. J. Choi, and D. H. Ko, J. Korean Phys. Soc. 40, (2002) 737.
9. H. X. Mo, X. P. Qu, J. H. Liu, G. P. Ru, and B. Z. Li, Solid-State and Integrated Circuit Tech., (1998) p. 271.
10. H. Iwai, T. Ohguro, and S. I. Ohmi, Microelectronic Engineering 60, (2000) 157.
11. J. G. Yun, H. H. Ji, S. Y. Oh, M. S. Bae, B. F. Hunag, Y. H. Park, Y. G. Kim, J. S. Wang, N. G. Sung, S. B. Hu, J. G. Lee, S. H. Park, H. S. Lee, W. J. Ho, D. B. Kim, and H. D. Lee, Accepted for publication in Electrochemical and Solid State Letters, Apr. 2004.