Surface free energy effects in sputter-deposited WNx films

Materials Transactions

Volumn 48, Issue 9, 2007, Pages 2449-2453

  Fan, Chun Wei ^a   Lee, Shih Chin ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Contact angle; Surface free energy; WNx

Indexed keywords

CHIP SCALE PACKAGES; CONTACT ANGLE; FREE ENERGY; HARDNESS; INTERFACIAL ENERGY; THERMODYNAMIC STABILITY; TUNGSTEN COMPOUNDS;

FORMING TOOLS; RADIO FREQUENCY (RF) SPUTTERING;

THIN FILMS;

EID: 35349025400     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2007095     Document Type: Article

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