Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800°C

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 34 A, Issue 10, 2003, Pages 2281-2287

  Wang, Chao Hong ^a   Chen, Sinn Wen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; PHASE EQUILIBRIA; SOLID SOLUTIONS; SOLUBILITY; THERMAL EFFECTS; TIN ALLOYS;

INTERFACIAL REACTIONS; ISOTHERMAL SECTION; REACTION PATHS;

TERNARY SYSTEMS;

EID: 0344062587     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-003-0292-9     Document Type: Article

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