Development and implementation of C4NP technology for 300 mm wafers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 878-884

  Giri, Ajay P ^a   Perfecto, Eric D ^a   Longworth, Hai P ^a   Semkow, Krystyna W ^a   Knickerbocker, Sarah H ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

C4NP TECHNOLOGY; GLASS MOLDS; LEAD-FREE SOLUTIONS; ROHS REQUIREMENTS; SOLDER MELT FILLING; VAPORIZED FLUX PROCESS;

MAGNETIC FLUX; MECHANICAL PROPERTIES; SEMICONDUCTOR MATERIALS; WAFER BONDING;

ELECTRONICS INDUSTRY;

EID: 35348913098     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373902     Document Type: Conference Paper

References (17)

1. J. Shah, D. Hawken, H. Longworth et al. "C4NP Lead free versus Electroplated High Lead Bumps" Proc. of IPC Works 2006, Dallas, Sept 14, 2006.
2. C. Handwerker, "Technology Assessment of Lead free Electronics", ACI Philadelphia Lead Free Summit, July 13th, 2005.
3. C. Handwerker, "NIST Research in Lead Free solders: Properties, Processing & Reliability" Presentation, Sept. 2002.
4. K.Moon, W. Boettinger, U. Kattner, F. Biancaniello, C. Handwerker, "Experimental and Thermodynamic Assessment of Sn-Ag-Cu solder alloys" J. Electron. Materials, .29(2000), p. 1122-1236.
5. T. Siewert, S. Liu, D. Smith, J.C. Madeni, "Data Base for solder Properties with Emphasis on Lead-Free Solders", Release 4.0 , National Inst.of Standards & Technology. Colorado School of Mines. Publication. Feb 2002.
6. M. Datta, R. Shenoy, C. Jahnes, P. Andricacos, J. Horkans, & J. Dukovic, "Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections" J. Electrochem. Soc., v. 142, n. 11, (1995), p. 3779-3785.
7. P. Gruber et al., "Low Cost Wafer Bumping", IBM J. Res. & Dev. Vol. 49 No. 4/5, July/September 2005.
8. E. Laine, K. Ruhmer, E. Perfecto, H. Longworth, D. Hawken "C4NP as a high-volume manufacturing method for fine-pitch and lead-free Flip Chip Solder Bumping" Proceedings of ECST, IEEE, Dresden, Germany, September, 2006.
9. K. Ruhmer et al., "C4NP: New Solder Bumping Technology - Low Cost and Lead Free", IMAPS Flip Chip Advanced Technology Workshop, Austin, TX, June, 2005.
10. B. Hochlowski, D. Naugle, "Low-Cost Wafer Bumping Using C4NP", Future Fab Intl. Vol. 18,1/12/2005.
11. P. Snugovsky, P. Arrowssmith, P. M. Romansky, "Electroless Ni/immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints", J. Electronic Materials, Vol. 30, n. 9 (2001) p.1262-1270.
12. K. Semkow, L. Wiggins, P. Flaitz, C. Goldsmith, "Investigation of Distribution of Phosphorous in Electroless Ni(P) Films", 207-th Meeting of tire Electrochem. Society, Quebec, Canada. Meeting Abstracts, May 3005, pp. 369.
13. K. Zeng, R. Stierman, D. Abbott, M. Murtuza, "The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/immersion gold plating"; J. of Metals, Vol. 58, n. 6 (2006), p. 75-79
14. V.Wakharkar, C. Matayabas, E. Lehman, R. Manepalli, M. Renavikar, et al, "Material Technologies for Thermomechanical Mangement of Organic Packages" Intel Technology Journal Vol. 09(4), 2005, pp 309-323.
15. P.Ratchev, T. Loccufier et al "A Study of Brittle to Ductile Fracture Transistion Temperature in Bulk PbFree Solders" EPMC 2005, June 12-15, Bugge, Belgium.
16. th ECTC, Reno NV, May, 2007.
17. th ECTC, 2005, pp 89-93.